Interfacial tractions at the broken ends will produce delamination.
斷頭處的界面引力將引起分層.
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The additional state of axisymmetric delamination problem of sandwich plates is studied.
研究了夾芯板軸對稱脫層問題的附加狀態(tài).
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A refined delamination model for laminated composite beams is presented.
建立了一種精化的復合材料層合梁脫層模型.
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Mechanisms of delamination, void defects in electroless plating and nonuniformity in electroplate were introduced.
重點介紹了鉆孔中分層 、 化學鍍銅中的氣泡缺陷、電鍍中的鍍層不均勻等缺陷產生的機理.
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Minimum adhesive strength build up ensures easy peeling without adhesive migration and delamination.
低逐加粘合度可確保易于剝離而不會產生溢膠和分離.
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In composite laminates there are four basic failure modes: matrix cracking, delamination, fiber breakage and debonding.
復合材料層合板中存在四種基本的失效模式,即: 基體開裂 、 分層 、 纖維斷裂及脫粘.
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This model has a good reusability and expansibility by Standardizing interfaces and internal delamination.
通過規(guī)范接口與內部分層,使得該模塊具有良好的可重用性和可擴展性.
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The main wear mechanisms of the coating are abrasive wear and delamination wear.
涂層的磨損機制主要是磨粒磨損和剝層磨損.
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Delamination caused by electrical - over - stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.
由過電應力 ( EOS ) 和再流焊中的水汽膨脹引起的分層會顯示出不同的失效模式.
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These inner and outer factors cause interface delamination, which is more serious in the density package.
這些內部和外部的因素直接導致了高密度芯片封裝中粘結膜界面分層現(xiàn)象日趨嚴重.
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When the parallel and vertical cracks encountered plate - like particles detached by delamination mechanism.
平行和垂向裂紋相遇,導致片狀顆粒按剝層機制脫落.
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By the global - local method, the delamination study was implemented from mm scale to um scale.
通過“全局 - 局部”模擬方法, 將各向異性導電膜的界面分層研究從毫米級深入到亞微米級.
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The results show that main failure types of PDC well bits are gross fracturing and delamination.
結果表明,PDC鉆頭 切削齒的微斷屑、宏觀破裂及剝離失效形式是造成PDC鉆頭早期失效的主要形式和原因.
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Most wave energy propagates only in the composite plates up and below the delamination.
并且波的能量大部分在脫層處的上、下復合材料板中來回傳播,被反射和透射出的能量很少.
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