Cu electrodeposition is one of the most important technologies in the Damascene fabrication of interconnects.
銅電沉積是互連“大馬士革”(Damascene)工藝中最為重要的技術(shù)之一.
互聯(lián)網(wǎng)
Plasma - induced damage on 90 nm Cu dual Damascene technology devices is investigated.
研究了等離子體工藝對90nm銅大馬士革工藝器件的損傷.
互聯(lián)網(wǎng)
"damascene city gates"
"a damascened sword"