The coefficient of thermal expansion ( CTE ) is very important for studies of composite and thermo - mechanical analysis.
本文采用激光散斑干涉法測(cè)量微電子金屬封裝用金屬?gòu)?fù)合 引線 的熱膨脹系數(shù).
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As CTE mismatch of materials, it is possible that chips crack in thermal stress lumped rigion.
并且由于環(huán)氧模塑封材料 、 芯片之間的熱膨脹系數(shù)失配,芯片熱應(yīng)力集中區(qū)域有發(fā)生脫層開裂的可能性.
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