To create new bonder business mode for new customer.
為新客戶創(chuàng)建新的保稅貿(mào)易模式.
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The X - Y table aquires the accuracy 5 μ m to ensure the exact positions of bonder spots.
X -Y工作臺要求實現(xiàn)精度達5μm,以便保證各焊點的精確位置.
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There is some additional function, such as generating reports from summary of bonder data.
還有一些附加的功能比如統(tǒng)計機臺的各項參數(shù)然后生成報表.
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Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.
基于解析模型的方法, 研究了超聲波在熱超聲金絲球引線鍵合機變幅桿中的傳遞規(guī)律.
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The automatic wire bonder is one of the primary equipments in semiconductor back - end production.
自動金絲球焊機是半導(dǎo)體制造后端工序的關(guān)鍵設(shè)備之一,圖像識別系統(tǒng)是其核心技術(shù).
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The device can replace the manual machine, and provide an equipment of varies die bonder.
該裝置可取代手動裝置, 為各種粘片機提供配套設(shè)備.
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This product design for IC assembly die bonding process on die bonder machine.
本產(chǎn)品是為IC封裝自動貼片機及其貼片工藝而設(shè)計.
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The auto Die Bonder for SOT - 23 transistor is a high - speed , high - precision, machinery electronics integrated equipment.
SOT-23晶體管封裝自動鍵合機是 高速 、 高精度機電一體化精密設(shè)備.
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This product design for IC assembly die attache process on die bonder machine.
本產(chǎn)品為IC集成電路封裝工藝芯片全自動固晶機上而專門設(shè)計.
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Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
粘片機是用于將IC芯片粘結(jié)到引線框架的半導(dǎo)體器件生產(chǎn)專用裝備.
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